By reducing noise and lowering power consumption at high carrier frequencies, we contribute to the energy-saving and noise reduction of white goods

Power semiconductor module "SLIMDIP-W"

Mitsubishi Electric Corporation will release "SLIMDIP-W" on January 15, 2020. This product, as a new product in the "SLIMDISTM" series of power semiconductor modules that drive white goods inverters, achieves low noise and reduces power consumption at high carrier frequencies ※ 1, contributing to energy conservation, noise reduction, and miniaturization of white goods such as washing machines and household air conditioners.

Carrier frequency: a physical quantity used to describe the number of switching times per unit time of power components in an inverter circuit.

Power semiconductor module "SLIMDIP-W"

Characteristics of the new product

1. Reduce power consumption during high carrier frequency driving, contributing to energy conservation and noise reduction of white goods

·Equipped with the latest ultra-thin RC-IGBT ※ 2 chip, it effectively reduces power consumption and motor noise during operation at high carrier frequencies by optimizing high-frequency switching characteristics ※ 3.

·The power consumption of the switch has been reduced by about 40% compared to existing products, contributing to the energy saving and noise reduction of white goods

RC-IGBT (Reverse Conducting IGBT): A power semiconductor chip that integrates IGBT and diode into one chip

Optimizing high-frequency switch characteristics can help reduce power consumption at high carrier frequencies.

※4 SLIMDIP-L

※ 5 Driving conditions: Comparison results at 125 ℃ and 5A

2. By reducing electromagnetic noise, contribute to the miniaturization and cost reduction of inverter systems

·Optimizing the switch characteristics of RC-IGBT to reduce electromagnetic noise can help reduce the number of components used to reduce noise on the substrate, contributing to the miniaturization and cost reduction of inverter systems

3. By increasing the design flexibility of inverter substrates, contribute to the miniaturization of inverter systems

·By configuring the GND terminal of the high-voltage drive power supply, the wiring of the high-voltage terminals on the inverter substrate can be simplified, contributing to the improvement of substrate design freedom and the miniaturization of the inverter system

Release Summary

Sales target

Our company officially produced the intelligent power semiconductor module "DIPIPM" with injection molded structure in 1997. It has built-in switching elements that make up the inverter circuit and control ICs for driving and protection. This product is widely used in inverters for white goods such as air conditioners, washing machines, refrigerators, and industrial motors, contributing to the miniaturization and energy-saving of inverter systems.

In recent years, due to the increasing awareness of energy conservation and environmental protection, inverters have been actively adopted around the world. In the washing machine market, high carrier frequency drives are widely expected to reduce motor noise, and the demand for small and lightweight modules to support this is further increasing.

To meet this demand, our company has released the "SLIMDIP-W" in SLIMDIP packaging, which achieves low noise and low power consumption at high carrier frequencies, contributing to energy conservation, low noise, and miniaturization of white goods such as washing machines and household air conditioners.

Main specifications

*Reprinted from the official website of Mitsubishi Electric